[Industry] Semiconductor-3: Manufacturing Process

 

Wafer Preparation: 

Extracting Silicons => Purification => monocrystalline ingots  => Slicing & Grinding =>...

=> Substrate for microelectronic devices

Oxidation:

Create a 'Glass Layer’ to block current flow and entry of other substances.

Si+O₂→SiO₂: Dry Oxidation, Slow (∵ O2 > H2O ), High quality 

Si + 2H2O →  SiO2 + 2H2  :Wet Oxidation, Fast/Low quality

Radical Oxidation: Slow, Best quality as using ‘Highly reactive gas’

Photolithography: 

PR Coating to wafer =>  Ultraviolet light passes through a mask/reticle => A certain pattern applied on surface

Etching: 

Removing material to form circuit features:

Wet Etching: Uses liquid chemicals (e.g., hydrofluoric acid) for isotropic removal

Dry Etching: Employs plasma (e.g., reactive ion etching/RIE) for anisotropic, high-precision patterns.

Deposition:

Deposition might be applied ‘before’ photolithography if necessary

 

Doping: 

 

Giving silicon abundant "free" electrons (or holes) that are weakly bound and easily move under a weak voltage, 

boosting conduction without collapsing the precise crystal structure.